Sem/edx providers in US 2021? Problem: A client was a manufacturer of beverages, bottled water, and other drinks. They received a customer complaint through one of their distributors, which indicated that a customer had been drinking a bottle of water, and as they neared the bottom of the bottle, found a mysterious white powder floating in the bottom. The customer returned the bottle and complained. The client hoped to identify the powder so they could both satisfy their end customer, as well as identify any potential problems in their manufacturing or bottling process.
Translucent or transparent coatings on metallic or semi-conductor substrates are very difficult to image due to their reflective nature. Nomarski/DIC imaging is an effective method for accentuating differences in thickness, density or the optical index in these cases. This analysis enhances and highlights subtle features with brilliant color gradients and captures them with a high resolution digital imaging system. Let us bring out your sample’s hidden features.
What if I want a service not listed in your services list? At MicroVision Labs the list of services which we provide to our clients is constantly growing. So if you don’t see what you are looking for give us a call or use the Contact Us tab. Also don’t forget to check our Additional Services Page to see if it might be listed there. Can you identify a contamination or unknown for us? Yes, we call that an Unknown Material ID and we routinely work on that kind of project. We have a number of individual tests designed to classify unknown materials. When combined with our extensive suite of equipment, these tests allow us to identify virtually any material. Give us a call and talk to one of our knowledgeable staff for more information. Explore more details on microvision.com. We partner with companies in all phases of product development and sales, including R&D, manufacturing, QC, advertising and failure analysis. Our laboratory offers a highly-trained and experienced staff utilizing a powerful set of analytical tools (SEM with EDS and backscatter detectors, Bruker X-Flash elemental mapping, X-Ray imaging, Micro-FTIR spectroscopy, Micro-XRF, light microscopy, cross sectioning/precision polishing and microhardness testing).
An affected floor tile was submitted to determine if the previous mold testing had missed a source on the tile backing or mastic. Additionally, a new tile from the same manufacturing lot was submitted for comparison. The process of preparing and examining the sample and reference tile was documented. Areas with darkened surface features were imaged and then cut out and examined. While the dark spots looked very discrete when examined by eye, under top light polarized microscopy they appeared more diffuse at the outer edges. The darkest areas surrounded what appeared to be particles embedded in the surface.
The profile of the flow of the solder at these bonds was documented using the SEM with backscatter imaging, which correlates brightness in the image with atomic density. Some voids were found in the solder as shown the SEM image. An EDS spectrum of the solder was acquired which showed that the solder was a tin/lead (80/20) solder. The EDS map clearly shows the copper wire and copper pad (red) with the tin lead solder (light blue) that appears to have flowed well and made a good bond between the copper elements. This map also shows the fiberglass bundles that add structural integrity to the board. See a few more details at here.